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A New Post Annealing Method for AlGaN/GaN Heterostructure Field-Effect Transistors Employing XeCl Excimer Laser Pulses

机译:用于采用Xecl准分子激光脉冲的AlGaN / GaN异质结构场效应晶体管新的退火方法

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A new post annealing method employing excimer laser pulses is proposed to improve the transfer characteristics and the breakdown voltage of the unpassivated AlGaN/GaN heterostructure field-effect transistor(HFET)and the passivated one.The XeCl excimer laser pulses with wavelength of 308 nm anneal the AlGaN/GaN HFET after the Schottky gate metallization.The interface defects between the Schottky gate metal and a GaN layer is decreased by the lateral heat diffusion of the laser pulses.Our experimental results show that the drain current and the maximum transconductance of the unpassivated AlGaN/GaN HFET after laser pulses annealing are 496 mA/mm and 134 mS/mm while a virgin device shows 434 mA/mm and 113 mS/mm,respectively.The proposed method anneals effectively the SiO_2 passivated AlGaN/GaN HFET and the leakage current of the passivated device is decreased from 483 nA to 29 nA.
机译:提出了一种采用准分子激光脉冲的新的退火方法,以改善未呈存的AlGaN / GaN异质结构场效应晶体管(HFET)的传递特性和击穿电压和钝化的。波长为308nm退火的XECL准分子激光脉冲在肖特基栅极金属化之后的AlGaN / GaN HFET。通过激光脉冲的横向热扩散来降低肖特基栅极金属和GaN层之间的界面缺陷。试验结果表明,漏极电流和未顺倒的最大跨导激光脉冲退火后的AlGaN / GaN HFET是496mA / mm和134ms / mm,同时分别显示434mA / mm和113ms / mm。该方法有效地退火SiO_2钝化的AlGaN / GaN HFET和泄漏钝化装置的电流从483 na降至29 na。

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