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POST ANNEALING METHOD OF GAN DEVICES BY EMPLOYING EXCIMER LASER PULSES

机译:利用准分子激光脉冲对GAN设备进行后退火的方法

摘要

The present invention after the annealing treatment (post annealing) relates to the technology , the drain current increase of the GaN devices , trans- conductance (transconductance) increases , and applying a reduced leakage current and breakdown voltage (breakdown voltage) excimer laser pulses to the rear element GaN device is made to increase (excimer laser pulse). After the annealing treatment method using the excimer laser pulses in accordance with the present invention is easy to process and can improve the electrical characteristics of the GaN devices without degradation of the Schottky gate (Schottky gate).
机译:退火处理(后退火)后的本发明涉及该技术,GaN器件的漏极电流增加,跨导(transconductance)增加,并且将减小的漏电流和击穿电压(击穿电压)准分子激光脉冲施加到该技术。使后部的GaN器件增加(准分子激光脉冲)。在根据本发明的使用准分子激光脉冲的退火处理方法之后,易于加工并且可以在不使肖特基栅极(肖特基栅极)劣化的情况下改善GaN器件的电特性。

著录项

  • 公开/公告号KR100625215B1

    专利类型

  • 公开/公告日2006-09-18

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20040097125

  • 发明设计人 하민우;이승철;한민구;

    申请日2004-11-24

  • 分类号H01L29/778;H01L21/324;

  • 国家 KR

  • 入库时间 2022-08-21 21:23:00

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