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POST ANNEALING METHOD OF GAN DEVICES BY EMPLOYING EXCIMER LASER PULSES

机译:利用准分子激光脉冲对GAN设备进行后退火的方法

摘要

The present invention after the annealing treatment (post annealing) relates to the technology , the drain current increase of the GaN devices , trans- conductance (transconductance) increases , leakage currents and reduced breakdown voltage (breakdown voltage) to increase the production of GaN devices are devices behind the excimer laser pulse (excimer laser pulse) to be applied . After processing an excimer laser annealing method using a different pulse to the invention is easy to process , and improved electrical characteristics can be improved without deterioration of the element of the GaN Schottky gate (Schottky gate).
机译:退火处理(后退火)后的本发明涉及该技术,GaN器件的漏极电流增加,跨导(transconductance)增加,漏电流和降低的击穿电压(击穿电压)以增加GaN器件的产量。是准分子激光脉冲(准分子激光脉冲)后面要应用的设备。在处理后,使用与本发明不同的脉冲的准分子激光退火方法易于处理,并且可以在不使GaN肖特基栅极(肖特基栅极)的元件劣化的情况下改善电特性。

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