THE DESIGN CRITERIA FOR A FULLY AUTOMATED ELECTROLESS PLATING TOOL

摘要

Mems, CMOS, and Under Bump Metalization (UBM) using Electroless or Immersion processes has become an accepted low cost option for deposition of conductive, bondable and mechanical layers. Throughput advantages are realized by batch processing of several wafers at a time while processing in cassette trays. Use of a dedicated (usually automated) tool for these depositions can yield throughput of up to several hundred wafers per shift depending on the tool size. This is a discussion of such a tool and the parameters involved.