首页> 外国专利> A process of electroless Tin Double Plating at TAPE AUTOMATED BONDING and CHIP on Film

A process of electroless Tin Double Plating at TAPE AUTOMATED BONDING and CHIP on Film

机译:薄膜TAPE自动键合和芯片上化学镀锡的双镀工艺

摘要

The invention relate to a method for transmitting packet switched data in a mobile communications system using an ARQ protocol. In the method the receiver requests, if necessary, retransmissions (212) of the originally sent transmission unit (212), until the quality of the combined transmission unit formed (208) of the originally sent transmission unit and its retransmitted copies corresponds to the predetermined quality level (210). The signal is not detected (214) until after this. If the packet is interleaved and encoded and it is found out that the packet is not faultless (218), retransmissions of the transmission units of the packet that are of the poorer quality are requested (220). The invention also relates to a mobile communications system implementing the method of the invention.
机译:本发明涉及一种在使用ARQ协议的移动通信系统中发送分组交换数据的方法。在该方法中,接收器在必要时请求重新发送(212)原始发送的传输单元(212),直到原始发送的传输单元形成的组合传输单元(208)的质量及其重新传输的副本对应于预定的质量等级(210)。直到此之后,才检测到该信号(214)。如果该分组被交织和编码并且发现该分组不是无缺陷的(218),则请求质量较差的分组的传输单元的重发(220)。本发明还涉及实现本发明的方法的移动通信系统。

著录项

  • 公开/公告号KR20010106298A

    专利类型

  • 公开/公告日2001-11-29

    原文格式PDF

  • 申请/专利权人 STEMCO CO. LTD.;

    申请/专利号KR20010051986

  • 申请日2001-08-28

  • 分类号C23C18/16;

  • 国家 KR

  • 入库时间 2022-08-22 00:32:08

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