Wafer Level Fabrication of Integrated Passive Components - A Key Technology for the System in Package Approach

摘要

This paper describes the thin film integration of passive components using wafer level packaging technologies. After a short introduction of the different implementation forms of integrated passives with this approach the specific design and build-up of the single passive elements will be introduced. In the following paragraph the fabrication technology will be explained step by step by means of a detailed process flow. Then the electrical performance of the realizable integrated passive components will be discussed. Results from the characterization of fabricated single elements as well as integrated filter structures will be summarized. Finally two integrated passive devices (IPDs), which include single passive elements and passive filter structures, will be presented.