Reliability Test and Failure Analysis of High-Density Packages with a Low-Temperature Lead-Free Solder (SnBiAg)

摘要

The High Density Packaging Users Group Consortium (HDPUG) has conducted a study of process development and solder-joint reliability of high-density packages on printed circuit boards (PCB) using a low melting temperature lead-free solder. The design for reliability, materials, and assembly process aspects of the project have been discussed in a companion paper, "Design, Materials, and Assembly Process of High-Density Packages with a Low-Temperature Lead-Free Solder (SnBiAg)", which is also published in these proceedings. In this study, reliability tests (e.g., temperature cycling and shock & vibration) and failure analysis of high-density packages on PCB with the low melting temperature lead-free solder (Sn-57wt%Bi-1 wt%Ag) are investigated.