POLYIMIDE MULTI-LAYER SUBSTRATE FOR HIGH-DENSITY SEMICONDUCTOR PACKAGE

摘要

We have developed a polyimide multi-layer substrate for semiconductor package. Interstitial via holes filled with conductive paste make the electrical connection in any layers in the multi-layer substrate to realize high-density wiring. The substrate shows reliable resistance to moisture and heat. Use of polyimide film make the substrate considerable thin compared to the conventional method using glass-epoxy. The present multi-layer substrate can be applied to a promising interposer for high-density semiconductor such as multi-chip module and stacked chip.