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Single-chip dual-band WLAN power amplifier using InGaP/GaAs HBT

机译:使用InGaP / GaAs HBT的单芯片双带WLAN功率放大器

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A single-chip dual-band power amplifier monolithic microwave integrated circuit (MMIC) operating at 3.5 V single supply has been developed for both WLAN 2.4 GHz and 5.2 GHz with IEEE 802.11b/g/a standards applications. The MMIC utilizes the process of WINs Corp. with an InGaP/GaAs HBT process. The dual-band power amplifier constructed based on the design of adaptive RF bias choke circuits and proper output matching networks. The proposed WLAN PA chip provides low current consumption and high power added efficiency. The WLAN-PA is implemented as a two-stage MMIC with active bias and input pre-matching and inter-stage matching networks integrated. In addition, the PA is a broadband power amplifier with above 20 dB flat gain between the frequency bands of 2.2 GHz to 5.5 GHz.
机译:用IEEE 802.11b / g / a标准应用为WLAN 2.4 GHz和5.2 GHz开发了一个单芯片双频功率放大器单片微波集成电路(MMIC)。 MMIC利用胜利公司的过程进行INGAP / GAAS HBT过程。基于自适应RF偏置扼流圈和适当的输出匹配网络的设计基于设计的双频功率放大器。所提出的WLAN PA芯片提供低电流消耗和高功率的效率。 WLAN-PA实现为具有积极偏置的两级MMIC,并集成的级联预匹配和级间匹配网络。此外,PA是宽带功率放大器,在2.2GHz至5.5 GHz的频带之间,具有高于20 dB的平坦增益。

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