As the electronic products become smaller and lighter with increasing number of functions, the demand for higher packaging density becomes stronger. In order to achieve this higher integration level, advanced packaging technologies for HDI PWBs have been introduced. The main focus in our development work during the past years has been on higher packaging density and on accommodating the needs of future chip packages. In volume production, cost and performance have to be balanced. As a result, manufacturing and material yield, process automation the cost of materials and added value technologies are key considerations in meeting the high volume requirements of the marketplace. This paper will describe how one of our development projects has evolved and how it has been possible to achieve the stringent tolerances required in the manufacturing processes.
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