Manufacturing Method of Socket Board for Semiconductor Test Using Build-up Board Manufacturing Technology

摘要

Disclosed is a method of manufacturing a multilayer printed circuit board that is easy to implement microcircuits, has excellent reliability, and can reduce manufacturing lead time and manufacturing cost. The method of manufacturing a multilayer printed circuit board includes preparing a plurality of circuit boards having at least one plated via hole and having circuit patterns formed on both sides thereof, preparing a plurality of pre-pregs with pre-preg via holes, and the plurality of circuits. And stacking the substrate and the plurality of prepregs by alternately matching them, and collectively bonding the plurality of circuit boards and the plurality of prepregs.