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HIGH FREQUENCY NOISE SOURCES EXTRACTION IN NANOMETIQUE MOSFETs

机译:纳米型MOSFET中的高频噪声源提取

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摘要

The continuing down-scaling of MOSFET's make their noise properties to be more and more fundamentals, for some difficulties may happen when considering high frequency applications. Indeed, though the intrinsic noise performances of MOSFET's are very promising, the technological process inherent to such devices when the device is scaling down makes de facto parasitic elements (such overlap capacitances, gate resistances) to limit greatly the f_(max) (maximum oscillation frequency) and then the noise performances of the device. Also, potential mismatch in Low Noise Amplifiers (LNA) along with the use of high losses Silicon Substrate may increase greatly the noise figure of the LNA, that will be much higher than the minimum noise figure of the stand alone device. As a general trend, the decrease of device's dimensions along with the decrease of the DC supply voltage will require in the future to have the availability of more and more accurate thermal (and related diffusion) noise models. These noise models can be issued from device physics models but also can be extracted from experimental noise measurements ; in such a case, one wants to perform accurate measurements of the noise parameters F_(min), R_n and Γ_(opt) of the Device Under Test (DUT). A lot of methods are available in the literature, we will focus here upon the one used in routine in our laboratory, which is based on noise figure measurements in a 50 Ω environment and physical considerations. The presentation of the NF_(50), method will be re-called prior describing the problems related to an accurate extraction of the noise sources. These problems will address, by the use of a physical noise modeling, a discussion related to the theoretical assumption (uncorrelated noise sources) made to extract the four noise parameters from the NF_(50) data versus frequency. Due to the low resistivity silicpn wafers used for such characterization, we will also pay attention towards the specific de-embedding noise procedure which needs to be used.'
机译:MOSFET的持续下缩放使其噪音属性越来越多的基本面,因为在考虑高频应用时可能会发生一些困难。实际上,尽管MOSFET的内在噪声性能非常有前途,但是当器件缩小时,这种装置固有的技术过程使得事实上的寄生元件(例如重叠电容,栅极电阻)极大地限制F_(最大值)(最大振荡频率)然后设备的噪声性能。而且,低噪声放大器(LNA)的潜在不匹配以及使用高损耗硅衬底可以大大增加LNA的噪声系数,这将远高于独立设备的最小噪声系数。作为一般趋势,设备尺寸随着DC电源电压的减小而降低,将来需要更越来越精确的热(和相关扩散)噪声模型。这些噪声模型可以从设备物理模型发出,但也可以从实验噪声测量中提取;在这种情况下,人们希望对被测设备(DUT)的设备的噪声参数F_(min),R_N和γ_(opt)进行精确测量。文献中提供了许多方法,我们将在我们实验室中使用的常规使用的方法,这是基于50Ω环境和物理考虑的噪声系数测量。 NF_(50)的呈现,方法将重新调用,以便在描述与准确提取噪声源相关的问题。这些问题将通过使用物理噪声建模来解决与理论上假设(不相关噪声源)相关的讨论,该讨论使得从NF_(50)数据与频率提取四个噪声参数。由于用于此类表征的低电阻率硅胶晶片,我们还将注意需要使用的具体取消嵌入噪声程序。

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