EFFECTS OF ABRASIVE MORPHOLOGY AND SURFACTANT IN NANO-CERIA SLURRY FOR SHALLOW TRENCH ISOLATION CHEMICAL MECHANICAL POLISHING

摘要

The effects of the abrasive morphology and surfactant concentration in ceria slurry on the removal rates for oxide and nitride films were investigated through a systematic chemical-mechanical-polishing (CMP) experiment. We found that the smaller the abrasives were, the more quickly the removal rates for both oxide and nitride films decreased with increasing surfactant concentration. This result was qualitatively explained by a model in which abrasive particles move through a viscous layer caused by surfactant adsorption on the film surface being polished.