Reliability Modelling of Embedded System-in-a-Package : Design and Packaging issues

摘要

A System-in-a-package (SiP) generally contains a variety of systems such as analog, digital, optical and Micro Electro Mechanical Systems, integrated in a system-level package connected through a substrate. In this article we propose a SiP model and evaluate its reliability during mechanical loading and thermal loading conditions. We propose a suitable substrate material from a selected list of materials. 3-D Finite Element Analysis (FEA) is carried out to assess stress distribution in three-point bending test and warpage of the package. We employ simulations with ANSYS software for this purpose. Based on the evaluation of the substrate material we propose suitable packaging approaches to realise the SiP as a complete microsystem.