conducting polymers; adhesives; smart cards; curing; ultraviolet radiation effects; integrated circuit packaging; chip-on-board packaging; Fourier transform spectra; spectrochemical analysis; scanning electron microscopy; shear strength; mechanical testing; environmental factors; integrated circuit testing; smart card fabrication; UV curable anisotropic conductive adhesive; curing conditions optimization; green electronics products; solder substitution; UV curable ACA; temperature sensitive electronic packages; bonding conditions; plated copper coil micro strip antenna; fabrication process; high power UV curing; chip-on-flex bonding; post curing; contactless smart cards; FTIR chemical analysis; Fourier transform infrared spectroscopy; curing degree; smart card read range; card reader; shear test; ACA joint breaking shear force; ACA joint failure mode; curing conditions; SEM; scanning electron microscope; shear strength; reading distance; COF bonding;
机译:在不同固化条件下使用UV固化各向异性导电胶进行导电胶粘接的研究
机译:固化剂和固化基材对低温可固化银导电胶的影响
机译:UV可固化导电墨水用于制造纺织品的导电电路和可穿戴UHF RFID标签
机译:使用紫外线固化各向异性导电粘合剂(ACA)的智能卡制备I部分:固化条件的优化
机译:低VOC,低粘度的紫外线阳离子辐射固化喷墨油墨系统和可见光可固化系统。
机译:使用穿孔石墨片和UV固化压敏粘合剂制造的导热膜
机译:UV可固化导电油墨用于制造纺织品的导电电路和可穿戴UHF RFID标签