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INVESTIGATIONS OF THE STRUCTURE AND STABILITY OF ALTERNATIVE GATE DIELECTRICS

机译:替代栅极电介质结构和稳定性的研究

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We discuss issues in the high-temperature stability of alternative high-k dielectrics grown on silicon, in particular the mechanisms of silicide reaction with Si substrates and polycrystalline Si gate electrodes and phase separation in high-k alloys. We present experimental data showing silicide formation and phase separation. For HfO_2-SiO_2 and ZrO_2-SiO_2 alloys, phase separation is expected for most compositions, although the pathways of microstructure evolution are different for different compositions. Calculations for the ZrO_2-SiO_2 system show that on the silica-rich side of the phase diagram, compositions with less than ~ 90 mol% silica are expected to phase separate at the typical device processing temperature of 1000 °C. For the pure binary alloys, such as ZrO_2, with oxygen vacancy concentrations greater than about 0.3%, the silicide formation reaction will become thermodynamically favorable.
机译:我们讨论在硅种植的替代高k电介质的高温稳定性中的问题,特别是硅化物反应与Si基材和多晶Si栅电极的机制和高k合金中的相分离。我们呈现实验数据,显示硅化物形成和相分离。对于HFO_2-SiO_2和ZrO_2-SiO_2合金,对于大多数组合物,期望相分离,尽管微观结构进化的途径对于不同的组合物是不同的。 ZrO_2-SiO_2系统的计算表明,在相图的富含二氧化硅侧,预期具有小于约〜90mol%二氧化硅的组合物在1000℃的典型器件加工温度下相位分离。对于纯二元合金,例如ZrO_2,具有大于约0.3%的氧空位浓度,硅化物形成反应将变得热力学良好。

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