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INVESTIGATIONS OF THE STRUCTURE AND STABILITY OF ALTERNATIVE GATE DIELECTRICS

机译:交替门介质的结构和稳定性的研究

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We discuss issues in the high-temperature stability of alternative high-k dielectrics grown on silicon, in particular the mechanisms of silicide reaction with Si substrates and polycrystalline Si gate electrodes and phase separation in high-k alloys. We present experimental data showing silicide formation and phase separation. For HfO_2-SiO_2 and ZrO_2-SiO_2 alloys, phase separation is expected for most compositions, although the pathways of microstructure evolution are different for different compositions. Calculations for the ZrO_2-SiO_2 system show that on the silica-rich side of the phase diagram, compositions with less than ~ 90 mol% silica are expected to phase separate at the typical device processing temperature of 1000 ℃. For the pure binary alloys, such as ZrO_2, with oxygen vacancy concentrations greater than about 0.3%, the silicide formation reaction will become thermodynamically favorable.
机译:我们讨论了在硅上生长的替代性高k电介质的高温稳定性问题,特别是与硅衬底和多晶硅栅电极发生硅化物反应的机理以及高k合金中的相分离问题。我们目前的实验数据表明硅化物的形成和相分离。对于HfO_2-SiO_2和ZrO_2-SiO_2合金,大多数成分的相分离是可预期的,尽管不同成分的微观结构演化途径不同。对ZrO_2-SiO_2系统的计算表明,在相图的富二氧化硅一侧,预计在1000℃的典型器件加工温度下,二氧化硅含量小于或等于90 mol%的成分会发生相分离。对于纯的二元合金,例如ZrO_2,其氧空位浓度大于约0.3%,硅化物的形成反应将在热力学上变得有利。

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