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Taguchi Method for Sintering Study of Nanocrystalline Silicon Carbide Fabricated using PlasmaPressure Compaction

机译:用Plasmapress压实制造纳米晶碳化硅碳化硅烧结研究的Taguchi方法

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Plasma Pressure Compaction is a novel sintering technique that enables the fabrication of silicon carbide samples with nanoscale microstructures at relatively low temperatures. To achieve SiC parts with a high final density and good mechanical properties, the effects of various sintering factors pertaining to the temperature-time profile and sintering pressure have to be characterized and optimized as well. This paper reports the use of Taguchi method in optimizing the process factors for sintering of nanocrystalline SiC powder (average size 100 nm). The effects of four sintering factors: temperature, time, pressure and heating rate on the final density and the mechanical properties of the sintered part were studied. The L_9 orthogonal array, signal to noise ratio and analysis of variance were employed to optimize the various factors and study the contribution of each factor to the output variables. It was found that all the chosen sintering factors have significant effect on the final density and the mechanical properties such as the hardness and the fracture toughness. A fractional final density of 98.1% was achieved with a low sintering temperature of 1600°C, hold time of 30 min, pressure of 50 MPa and heating rate of 100°C/min. The hardness value of 18.4 GPa and the fracture toughness of 4.6 MPa√m were comparable to the values reported in the literature for SiC samples sintered at much higher temperature.
机译:等离子体压力压实是一种新型烧结技术,其能够在相对低的温度下用纳米级微结构制造碳化硅样品。为了实现具有高最终密度和良好机械性能的SIC部件,也必须表征和优化各种烧结因子的各种烧结因子的影响。本文报道了使用Taguchi方法优化纳米晶SiC粉末烧结的过程因子(平均大小100nm)。研究了四种烧结因子的影响:研究了最终密度的温度,时间,压力和加热速率和烧结部件的机械性能。 L_9正交阵列,用于噪声比和方差分析的信号以优化各种因素并研究每个因素对输出变量的贡献。发现所有选择的烧结因子对最终密度和机械性能(如硬度和断裂韧性)具有显着影响。通过低烧结温度为1600℃,保持时间为30分钟,压力为50MPa,加热速率为100℃/分钟,达到98.1%的分数最终密度。 18.4GPa的硬度值和4.6MPa√m的断裂韧性与烧结在更高温度下烧结的SiC样品中报道的值相当。

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