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Optimizing the Print Performance of SMT Adhesives

机译:优化SMT粘合剂的印刷性能

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Adhesive printability test results using several thick stencil materials and aperture cross-sections to achieve a significant range of deposit heights and diameters are presented. Adhesive printing performance is gauged via quantitative adhesive deposit height a'nd diameter data using laser triangulation techniques. The effects on the deposit height range for a spectrum of aperture diameters is quantified with stencil and process guidelines proposed. Printing methods for SMT adhesives for both pre and post AI assembly are compared. Normal Squeegee printing and Enclosed Print Head (EPH) printing method results are compared and contrasted. Data presented is from the measurement of 105,600 printed dots.
机译:呈现使用多个厚模板材料和孔径横截面的粘合剂可印刷性测试结果,以实现显着范围的沉积物高度和直径。使用激光三角测量技术通过定量粘合剂沉积物高度A的直径数据测量粘合剂印刷性能。用模板和工艺指南量化对孔径光谱的沉积高度范围的影响。比较Pre和Ai组件的SMT粘合剂的印刷方法。将常规刮板印刷和​​封闭的打印头(EPH)打印方法结果进行了比较和对比。提出的数据来自测量105,600印刷点。

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