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The Formal Development of a Pb-Free Electronics Manufacturing Operation

机译:全面开发PB无电子制造运作

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To successfully navigate the transition from an entrenched Pb-based electronics manufacturing model to a fully integrated Pb-free manufacturing operation will require significant and coordinated modifications to many elements of currently operating electronics manufacturing organizations. Starting with the fact that no "drop-in" replacement for eutectic tin (Sn) - lead (Pb) solder exists, the demands of Pb-free production will alter most facets of the manufacturing organization, from higher temperature processing with more expensive Pb-free alloys, to specifying component and laminate requirements able to tolerate the new constraints, to formulating new approaches for testing, inspection and quality control, to understanding the unknown reliability of Pb-free products. The elimination of Pb from electronic products will impact companies across the entire organization, not just at the manufacturing level. This will include product designers, component engineers, purchasing and quality assurance departments, sales and marketing groups, material vendors, assembly equipment suppliers original equipment and contract manufacturers, and recyclers. Clearly there is no shortage of work that needs to be done to place our understanding of Pb-free electronics production on the same level as the Pb-based counterpart. This paper discusses the comprehensive experimental approach that Cookson Electronics Division has taken to address the conversion to an integrated Pb-free manufacturing operation. The initial focus has been on materials compatibility for Pb-free processing using statistically based experimental designs. The study investigates compatibility between several Pb-free alloys, board and lead finishes, and flux types for both wave and paste/reflow soldering, including extensive reliability testing of the Pb-free assemblies. The statistical methodology and the results from the study will provide guidance for the implementation of successful and reliable Pb-free processing and serves as a model for how to establish a dedicated Pb-free electronics manufacturing operation.
机译:为了成功地驾驭从根深蒂固的含铅电子制造模式完全集成的无铅生产经营需要于当前运行的电子制造企业的许多元素显著和协调修改的过渡。的事实出发,没有“下拉式”替代共晶锡(Sn) - 铅(Pb)焊料存在,无铅生产的需要将改变制造组织的大多数方面,从较高温度的处理与更昂贵的铅-free合金,于指定能够容许所述新的约束,以制定用于测试,检测和质量控制的新方法分量和层压体的要求,以了解的无铅产品的未知的可靠性。铅从电子产品的淘汰将影响公司在整个组织中,不仅在制造水平。这将包括产品设计师,工程师组成,采购和质量保证部门,销售和市场营销组,材料供应商,装配设备供应商的原始设备和合同制造商和回收商。显然,没有工作的不足,需要做才能把我们的无铅电子产品生产的理解在同一水平上的含铅对应。本文探讨了综合实验的办法,确信电子司已采取的应对转变为一个综合无铅制造业务。初始重点是材料的相容性,使用基于统计的实验设计无铅处理。几个无铅合金,板和引线饰面,和磁通类型之间的研究调查兼容性两个波和粘贴/回流焊接,包括无铅组件的广泛可靠性测试。该统计方法,并从研究的结果将成功和可靠的无铅处理的实施提供指导,并作为如何建立一个专门的无铅电子制造操作的模式。

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