The method of mount strain gauges has been used to measure the stress/strain hysteresis of solder joints under thermal cycling. Results show evidence for the interaction between creep and fatigue and that the shear modulus decreased along with the process. High-sensitivity moire interferometry has been used to measure the residual thermal strain distribution of the solder joints with various thermal cycling parameters. The experimental results demonstrate that the mismatch of CTE between the two parts joined by the solder joints results in large shear strains in the solder joints, and that the strain distribution is not uniform.
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