The New Organic Laminate for Over GHz Packaging

摘要

We have developed the new organic laminate, LCPC (laminated ceramic polymer composite), which shows superior electrical properties such as low dielectric constant and low dissipation factor over a GHz frequency range. The LCPC also shows extremely low coefficient of thermal expansion and high flexural modulus, and it is very favorable to packaging dielectrics. We have applied Kyocera's original copper-pattern transfer method and simultaneous curing process technology, and successfully manufactured the substrates for the next-generation market requirements. It has become increasingly important to understand the high frequency performance of transmission lines fabricated in and on the substrates. We have studied the fundamental transmission properties of GSL (grounded stripline) and GCPW (grounded coplanar waveguide). The frequency was swept from 100MHz to 40.1 GHz, and all two-port parameters such as S11 (reflection) and S21 (transmission) were extracted. We have acquired the data that the reflection loss S11 is generally much less than -15dB over very wide frequency range for both line structures. The signal attenuation of the GSL is maintained at about 0.5dB/cm at 13GHz, increasing to about 1.0dB/cm at 30GHz, which results indicate these substrates have the excellent signal transmission properties almost equal to PTFE based ones. Furthermore, we have studied the effects of the width of the transmission lines and the vertically stacked vias, and the results suggest the design notes for high-speed signal transmission.