Terminal formation method of lamination type package element and lamination type package element, formation method of lamination type package, and lamination type package

摘要

The semiconductor chip module whose degree of freedom of position of the terminal for connection of allotment and each semiconductor chip of circuit to each semiconductor chip is high is offered. As for this invention, portion of the terminal for connection which is connected with the circuit pattern which is provided on the surface is provided on the side, superposing the plural semiconductor chips, it regards the semiconductor chip module which it connects. The terminal part for connection side in each semiconductor chip, is connected mutually by wiring pattern. The terminal for connection in the semiconductor chip is something which reaches to the side from the surface, applying the fact that it sprays the electric conduction material in mist condition is something which was formed.