High-Density Interconnection 3D Packaging Technology for CCD Micro-Camera System

摘要

High-density interconnection 3D packaging technology for a CCD micro-camera system has been developed by applying high-density stack-unit modules that have fine-pitch flip-chip interconnections within copper-column-based solder bumps and high-aspect-ratio sidewall footprints for vertical interconnections. Copper-column-based solder bump design and underfill encapsulation resin characteristics were optimized to reduce the strain in the bump and to achieve fine-pitch flip-chip interconnection with high reliability. High-aspect-ratio sidewall footprints were realized by the copper-filled stacked vias at the edge of the module substrate. The fabricated high-density interconnection 3D packaging module of the CCD imaging data transmission circuit has operated satisfactorily as the CCD micro-camera system. The technology was confirmed to be effective for incorporating many devices of different sizes at far higher packaging density than it is possible to attain using conventional technology.