Development of the MEMS Methodology to Micro Heat Sink

摘要

The micro fin structures made by the MEMS technique are presented in this work. A study was conducted to evaluate the micro fin structures used as a cooling technology for high-density heat dissipation IC package. The investigation focused on the new manufacturing process to make the structures and determination of the cooling effect for the different micro fin structures design. The effects of airflow velocity, input power, and fin pitch were determined for experimental test under the environments of the natural convection and force convection. The base size of heat sink is 35mm x 35mm in order to apply to BGA or Flip chip package manufactures, and the heights of micro fins are from 300μm to 10.2mm, and the aspect ratio of fins are from 1 to 50 according to variety fin height. The materials of the micro fins are used copper or aluminum or silicon. The fin scales have broken the limit of commercial heat sinks.