Flip chip variable high Q MEMS capacitor for RF applications

摘要

This paper describes the novel design of an electrostatic controllable Flip Chip variable MEMS capacitor. The variable capacitor is constructed using the Cronos MUMPS technology and flip chip technology processing. Two design alternatives are discussed, and the effects of thermal mismatch on the device are presented. A near linear response is achieved by having an array of individual plates connected to the bonding pads by springs of varying width. This configuration causes the top plates to snap down in a cascading manner when actuated by electrostatic forces.