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Dopant Effect On NiGe Texture During Nickel Germanide Growth

机译:对Nige纹理的掺杂剂作用在镍锗生长期间

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In this paper, we report on the solid state reactions of Ni thin films (6nm to 12nm) deposited on Ge (001). Especially, the influence of the substrate dopants (As and BF{sub}2) is investigated. TEM and SIMS analyses point out the presence of an additional phase at the NiGe/Ge interface. EELS and SIMS measurements reveal that this phase contains Ni and Ge. On the another hand, ex-situ XRD spectra allows to determine a change in NiGe texture with Ge(001) doped or undoped. In situ XRD confirms that the kinetics shifts from simultaneous to sequential growth of nickel germanides, as predicted previously. Moreover, a recrystallization of NiGe is observed only on the undoped substrate. This recrystallization can be attributed to a contribution of a stress term in addition of the surface energy. This stress term becomes minor when temperature increases and Ni-rich phase is completely consumed. The presence of dopants, probably at the NiGe/Ge interface could reduce this stress and thus the recrystallization.
机译:在本文中,我们报道了沉积在Ge(001)上沉积的Ni薄膜(6nm至12nm)的固态反应。特别地,研究了衬底掺杂剂(如和BF {Sub} 2)的影响。 TEM和SIMS分析指出Nige / GE接口处的附加阶段的存在。 EELS和SIMS测量揭示了该阶段包含NI和GE。在另一只手中,前地XRD光谱允许用GE(001)掺杂或未掺杂的GE(001)确定Nige纹理的变化。原位XRD确认动力学因以前预测的预测而同时转向镍锗的顺序增长。此外,仅在未掺杂的基底上观察到Nige的重结晶。该重结晶可以归因于添加表面能的应力术语的贡献。当温度增加时,这种应力术语变得轻微,并且完全消耗了Ni的相。掺杂剂的存在,可能在nige / ge界面处可以降低这种应力,从而降级。

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