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Dopant Effect On NiGe Texture During Nickel Germanide Growth

机译:锗化物生长过程中掺杂剂对NiGe织构的影响

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In this paper, we report on the solid state reactions of Ni thin films (6nm to 12nm) deposited on Ge (001). Especially, the influence of the substrate dopants (As and BF_2) is investigated. TEM and SIMS analyses point out the presence of an additional phase at the NiGe/Ge interface. EELS and SIMS measurements reveal that this phase contains Ni and Ge. On the another hand, ex-situ XRD spectra allows to determine a change in NiGe texture with Ge(001) doped or undoped. In situ XRD confirms that the kinetics shifts from simultaneous to sequential growth of nickel germanides, as predicted previously. Moreover, a recrystallization of NiGe is observed only on the undoped substrate. This recrystallization can be attributed to a contribution of a stress term in addition of the surface energy. This stress term becomes minor when temperature increases and Ni-rich phase is completely consumed. The presence of dopants, probably at the NiGe/Ge interface could reduce this stress and thus the recrystallization.
机译:在本文中,我们报道了沉积在Ge(001)上的Ni薄膜(6nm至12nm)的固态反应。尤其是,研究了衬底掺杂剂(As和BF_2)的影响。 TEM和SIMS分析指出,NiGe / Ge界面处存在附加相。 EELS和SIMS测量表明该相包含Ni和Ge。另一方面,异位XRD光谱可以确定掺杂或未掺杂Ge(001)的NiGe纹理的变化。如先前所预测,原位XRD证实动力学从同时发生的锗锗转变为顺序生长。而且,仅在未掺杂的衬底上观察到NiGe的再结晶。该重结晶可归因于除了表面能之外的应力项的贡献。当温度升高并且富Ni相被完全消耗时,该应力项变得很小。可能在NiGe / Ge界面处存在的掺杂剂可以减少这种应力,从而降低重结晶。

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