Results from the polishing of Cu and Ta in various chemical environments, namely, ferric nitrate, hydrogen peroxide/glycine and potassium iodate, with silica and alumina abrasives are discussed with an emphasis on the polishing mechanisms. The pH has a great impact on the polish rates of both Cu and Ta. The role of different types of abrasive particles, alumina and silica, is compared. Finally, some preliminary results regarding the transport of slurry that shed light on the role of abrasives during the polishing are also presented.
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