300 mm FACTORY SIMULATION MODELING AND ANALYSIS

摘要

To facilitate the conversion from 200-mm to 300-mm wafer manufacturing, International SEMATECH formed a team of engineers and modelers to work on a project with the objective of using discrete-event simulation to develop an understanding of factory operational issues associated with 300-mm wafer manufacturing. The team has developed a generic factory that can be easily altered to perform experiments. A base layout was designed to support the factory performance requirements of a factory starting 20,000 wafers per month. An AutoSched~(TM)/AutoMod~(TM) simulation model was built for a generic factory with a single 180-nm logic process flow. Several experiments have been performed to compare the effects of various factors on factory productivity as defined by cycle time, work in process inventory (WIP), and utilization. These experiments include studying the effects of variations in the factory layout, AMHS equipment downtime, multiple process flows, and number of stockers. The simulation models show that the International SEMATECH member company vision of a fully automated factory including automated material handling performance currently available would sufficiently support the move demand in all bays.