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Influence of 3-N,N-Dimethyldithiocarbamoyl-1-Propanesulphonic Acid on the Kinetics and Morphology During Copper Deposition

机译:3-N,N-二甲基二硫代氨基甲酰基-1-丙二酸对铜沉积过程中动力学和形态的影响

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The influence of 3-N,N-dimethyldithiocarbamoyl-1-propanesulphonic acid(DPS),one of the common additives in commercial acid copper electroplating bath,on the cathodic reduction of cupric ions has been studied by rotating disc voltammetry,cyclic voltammetry and potential step techniques.The DPS additive [(CH_3)_2NC(S)S(CH_2)_3SO_3H] added as a sodium salt was not reducible in 1.8M H_2SO_4 at a Cu cathode.A mass transport controlled oxidation wave was observed at approx 1.2 V vs.SCE at a Pt anode.The interaction of DPS with Cu(I)and Cu(II)ions in aqueous-acidic media was studied by UV-VIS spectroscopy.The results suggest the formation of a Cu(I)DPS type complex,but the similar interaction with copper(II)ions was not observed.
机译:通过旋转盘伏安法,循环伏安法和潜力研究了3-N,N-二甲基二硫酸(DPS),商业酸铜电镀浴中的常见添加剂之一的普通添加剂的影响,已经研究了铜离子的阴极还原。步骤技术。作为钠盐加入的DPS添加剂[(CH_3)_2NC(S)S(CH_2)_3SO_3H]在Cu阴极下在1.8M H_2SO_4中未降低。在大约1.2V Vs的情况下观察到大量传输控制的氧化波在Pt阳极处。通过UV-Vis光谱研究了DP与Cu(I)和Cu(II)离子中的Cu(I)和Cu(II)离子的相互作用。结果表明Cu(I)DPS型复合物的形成,但没有观察到与铜(II)离子的类似相互作用。

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