Bath used for copper plating an electrode in an electronic component contains a copper compound, a copper ion complex former, a reducing agent, a reagent for influencing the pH, and a carboxylic acid as oxidation accelerator

摘要

Bath contains a copper (II) compound, a copper (II) ion complex former, a reducing agent, a reagent for influencing the pH, and a carboxylic acid as oxidation accelerator. An Independent claim is also included for a process for electroless copper plating comprising immersing a substrate in the above bath so that the surface of the substrate is copper plated.