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Influence of Iodide Ion on the Anodic Dissolution and the Cathodic Deposition of Copper in Acidic Copper Sulfate Solution

机译：碘离子对酸性硫酸铜溶液中铜的阳极溶解和阴极沉积的影响

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津留豐; 細川邦典;
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年度 1980
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正文语种 ja
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1. Indole and 5-chloroindole as inhibitors of anodic dissolution and cathodic deposition of copper in acidic chloride solutions [J] . Scendo M., Poddebniak D., Malyszko J. Journal of Applied Electrochemistry . 2003,第3a4期

机译：吲哚和5-氯吲哚作为酸性氯化物溶液中铜的阳极溶解和阴极沉积抑制剂
2. Indole and 5-chloroindole as inhibitors of anodic dissolution and cathodic deposition of copper in acidic chloride solutions [J] . M. Scendo, D. Poddebniak, J. Malyszko Journal of Applied Electrochemistry . 2003,第3a4期

机译：吲哚和5-氯吲哚作为酸性氯化物溶液中铜的阳极溶解和阴极沉积抑制剂
3. The Effect of Tellurium Presence in Anodic Copper on Kinetics and Mechanism of Anodic Dissolution and Cathodic Deposition of Copper [J] . Zvonimir D. Stankovic, Vladimir B. Cvetkovski, Vesna J. Grekulovic, International Journal of Electrochemical Science . 2013,第5期

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4. Effect of PEG(Polyethylene glycol)on the anodic dissolution of copper in acid copper electrodeposition baths [C] . Ki-Deok Song, Kwang-Bum Kim The Meeting of the Electrochemical Society . 2001

机译：PEG（聚乙二醇）对酸铜电沉积浴铜阳极溶解的影响
5. THE KINETICS OF THE DISSOLUTION REACTIONS OF COPPER AND COPPER - IRON-SULFIDE MINERALS USING FERRIC-SULFATE SOLUTIONS. [D] . LOWE, DONALD FRANK. 1970

机译：硫酸铁溶液对铜和铜-硫化铁矿物质溶解反应的动力学。
6. Light-IrradiatedElectrochemical Direct Constructionof Cu2O/CuO Bilayers by Switching Cathodic/Anodic Polarizationin Copper(II)–Tartrate Complex Aqueous Solution [O] . Masanobu Izaki, Takayuki Koyama, Pei Loon Khoo, 2020

机译：光照射电化学直接施工阴极/阳极极化转换制备Cu2O / CuO双层膜酒石酸铜（II）络合物水溶液中的含量
7. The effect of bi presence as impurities in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper [O] . Stanković Zvonimir D., Cvetkovski Vladimir B., Grekulović Vesna J. 2010

机译：阳极铜中Bi存在作为杂质对铜的阳极溶解和阴极沉积动力学和机理的影响
8. Some Mechanical Properties of Copper Electrodeposited from Commercial Pyrophosphate and Acid Copper Sulfate Solutions [R] . Wiesner, H. J., Frey, W. P. 1978

机译：商品焦磷酸盐和酸性硫酸铜溶液电沉积铜的某些力学性能

Influence of Iodide Ion on the Anodic Dissolution and the Cathodic Deposition of Copper in Acidic Copper Sulfate Solution

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