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THE MICROSTRUCTURE AND PROPERTIES OF LAYERED OXIDE THIN FILMS FABRICATED BY MOCVD

机译:MOCVD制造的层状氧化物薄膜的微观结构与性能

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For the first time, layered oxide thin films of SrBi_2Ta_2O_9 (SBT) with very good ferroelectric properties have been prepared by direct-liquid-injection MOCVD technique. The SBT films were deposited onto both Pt/Ti/SiO_2/Si wafers and single-crystal sapphire substrates to measure their phase formation, microstructure and ferroelectric properties. Crystalline SBT phase had been observed at temperatures as low as 500 deg C. With increasing deposition temperature above 500 deg C, the grain size of SBT thin films was increased from 0.01 #mu#m to 0.2 #mu#m. The films were found to be dense and homogenous. Typically, SBT thin films of 200 nm thick with grain size about 0.1 #mu#m have 2Pr around 10 #mu#C/cm~2 at 5V, Ec 55.7 kV/cm, and dielectric constant around 100. The leakage currents were as low as 8 X 10~(-9) A/cm~2 at 150 kV/cm. The films also showed fatigue-free characteristics: no fatigue was observed up to 1.4 X 10~(10) switching cycles. This development of MOCVD technique for good quality SBT films make their integration into high density nonvolatile memories relatively easy.
机译:首次,通过直接液体注射MOCVD技术制备了具有非常好的铁电性能的Srbi_2Ta_2O_9(SBT)的层状氧化物薄膜。将SBT薄膜沉积在Pt / Ti / SiO_2 / Si晶片和单晶蓝宝石基材上,以测量它们的相形成,微观结构和铁电性能。在低至500℃的温度下观察到结晶SBT相。随着500℃的沉积温度的增加,SBT薄膜的晶粒尺寸从0.01#mu#m至0.2#m#m增加。发现薄膜是致密的和均匀的。典型地,薄SBT为200nm的膜厚,具有约0.1#亩粒度#m具有围绕100周围的2Pr 10#亩#C / cm〜2的在5V,55.7的Ec千伏/厘米,和介电常数的漏电流分别为低至8×10〜(-9)A / cm〜2,150 kV / cm。该薄膜还显示出无疲劳特性:切换循环中没有观察到1.4×10〜(10)的疲劳。这种MOCVD技术的良好质量SBT薄膜的开发使其集成到高密度非易失性存储器中相对容易。

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