In this work, three different conductive adhesives have been used to study the conductive adhesive joint reliability under "full-cure" conditions. Differential Scanning Calorimetry (DSC) was used to characterise the curing degree. 0805 chipcomponents were assembled on FR-4 substrate. After full-cure, the electrical and mechanical properties were measured directly after bonding, after damp heat 85°C, 85%RH test and after temperature cycling from -40 to +125°C.The results show that in the fully cured rate, the electrical and mechanical properties of the conductive adhesive joints are stable, especially on Au bonding surface. In the over-cured state, electrical and mechanical performance have been reduced.However, these are within standard deviation or in the same range as in the fully cured state. Therefore, no strong evidence is observed on the negative effect of over-cure on the joint reliability.
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