首页> 外文OA文献 >Degradation Mechanism on Joint of Betweens Ag-Epoxy Conductive Adhesive and Sn/Ni Plating Chip by Reliability Test

【2h】

Degradation Mechanism on Joint of Betweens Ag-Epoxy Conductive Adhesive and Sn/Ni Plating Chip by Reliability Test

机译：通过可靠性试验（可靠性试验）对乙基环氧导电粘合剂和SN / Ni电镀芯片接头的降解机制

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Woo-ju JEONG; Hiroshi NISHIKAWA; Shinsuke OKUMI; Takehiro MIZUNO; Daisuke ITOU; Tadashi TAKEMOTO;
展开▼
作者单位

展开▼
年度 2005
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Degradation Mechanism of Ag-Epoxy Conductive Adhesive/Sn-Pb Plating Interface by Heat Exposure [J] . M. Yamashita, K. Suganuma Journal of Electronic Materials . 2002,第6期

机译：Ag-环氧导电胶/ Sn-Pb镀层界面受热降解机理
2. Differences in heat exposure degradation of Sn alloy platings joined with Ag-epoxy conductive adhesive [J] . Munenori Yamashita, Katsuaki Suganuma Journal of Materials Science . 2006,第2期

机译：Ag-环氧导电胶对锡合金镀层热暴露降解的影响
3. A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling [J] . Zhang Shuye, Paik Kyung-Wook Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2016,第2期

机译：聚合物粘弹性和水溶胀在压力锅试验中Sn58Bi焊料各向异性导电膜接头失效机理及可靠性提高的研究
4. Degradation mechanism of Ag-epoxy conductive adhesive joints by heat and humidity exposure [C] . Sun Sik Kim, Keun Soo Kim, Suganuma Katsuaki, Electronics Systemintegration Technology Conference . 2008

机译：通过热湿度暴露的Ag-环氧导电粘合剂的降解机理
5. Reliability of solder joints in flip chip technology: Approaches from fundamental studies of wetting, interfacial reaction, mechanical shear testing, and electromigration. [D] . Liu, Cheng-Yi. 2000

机译：倒装芯片技术中焊点的可靠性：润湿，界面反应，机械剪切测试和电迁移等基础研究的方法。
6. Rendering Wood Veneers Flexible and Electrically Conductive through Delignification and Electroless Ni Plating [O] . Minfeng Chen, Weijun Zhou, Jizhang Chen, 2019

机译：通过木质化和化学镀镍工艺使木质单板具有柔性和导电性
7. The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate [O] . Gustafsson Katrin, Mannan Samjid H., Lai Zonghe, 1997

机译：在FR-4基板上使用各向异性导电粘合剂，温度升温速率对倒装芯片接合质量和可靠性的影响

Degradation Mechanism on Joint of Betweens Ag-Epoxy Conductive Adhesive and Sn/Ni Plating Chip by Reliability Test

著录项

引文网络

相似文献

相关主题

期刊订阅