With the increase in clock rates for digital packages, a system's level approach to package design is often necessary to ensure that the package meets the product specifications. This often requires a level of integration that conbines models of the individual components of the board, to repre-sent the system. Though this is required to study the packaging effects on most digitalsystems such as EMI, noise sensitivity, impedance mismatch effects and propagation delay, most ECAD tools do not follow this approach since it introduces an additional level of complexity in the design process. Due to the large number of passives and high frequencies supported in RF pack-ages, the next generation packages will consist of embedded passive components in the substrate, thus requiring a completely new approach to ECAD tool integration, to account for EMI related issues This talk will be split into two parts. The first aprt will discuss tool integration for digital packages using a system level approach and will discuss a prototype tool being developed at the Packaging Research Center. The second part will discuss some of the challenges in RF packages rlating to the use of embedded components, and the approach being baken at the Packaging Research Center from a tool integration standpoint.
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