35.1: A Super Chip-on-Glass (COG) Bent-Glass-Bonding (BGB) Technology

摘要

We have improved our current COG technology [1][3] in order to develop our new COG (Chip On Glass) technology, "BGB (Bent Glass Bonding)", which is the ultimate in this field. This new technology dispenses with the FPC (Flexible Printed Circuit) which had been used for the connection with the TFT-LCD (Thin Film Transistor-Liquid Crystal Display) panel. This is because the new COG substrate unites and carries out the functions of the FPC. This COG substrate is a long, thin and narrow substrate on which driver ICs are assembled exclusively for use with the COG. This COG substrate is bonded face down directly onto the TFT-LCD panel without the assistance of an FPC. As a result, the bezel size of the TFT-LCD module can be reduced further by bending the narrow COG substrate along the center line extending the length of the substrate after it is bonded with the TFT-LCD panel. This face down bonding produced highly accurate and minute interconnections. This new "BGB" COG technology also enables low cost production of COG. In addition, this technology will be suited for advanced LCD packaging in the future, that with a very small and thin module size and an emphasis on large display area, SOPs (System On Panels), etc.