Chip-on-glass (COG) package structure of LCD and method of manufacturing the same

摘要

[0001] The present invention relates to a chip-on-glass package structure of an LCD and a manufacturing method thereof, and more particularly, to a chip-on-glass package structure of an LCD device in which an LCD driver chip is directly mounted and fixed to a TiFTi glass of an LCD-, And the LCD driver chip is directly attached and fixed to the TEFFITY glass using a low melting point solder.;The TiFTi glass is provided with a drive metal layer and a chromium layer for preventing solder from overflowing. A Cr / Cu / Au metallization layer is formed on the bond pad of the LCD driver chip, and a mounting device And thermocompression bonding.;The present invention has the self-alignment effect, the electric resistance is low, the conductivity is improved, and the chip can be repaired when defective.