Microsystem packaging in 3D

摘要

Packaging influences the reliability and performance of Microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package (MCM-V) is presented. Finite element techniques are used to analyse the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.