Advanced Packaging of 3D Fan-out RF Microsystem for 5G IoT Communication

摘要

An advanced packaging method of 3D fan-out RF microsystem for 5G IoT communication is studied. Through the double-sided wiring technology on the glass wafer, the fabrication of the antenna array is realized, and the integration of the RF microsystem is completed by using the resin fan-out package. Finally, the electrical interconnection between the RF microsystem and the transceiver antenna is realized through the permanent bonding process between the resin wafer and the glass wafer. The loss of the RF transmission line is measured by using the RF millimeter wave probe table. The results show that the RF transmission loss from the chip end to the antenna end in the glass wafer fan-out package is very small, and it is only 0.25dB when working in 28GHz. A slot coupling antenna is designed on the glass wafer. The antenna can operate at 28GHz with a gain of 5.91dB. This successful demonstration provides a practical solution for the integration of low-loss RF microsystems for 5G IoT communications.