Planar surface-micromachined pressure sensor with a sub-surface, embedded reference pressure cavity

摘要

Planar, surface micromachined pressure sensors have been fabricated by an extension of the chemical-mechanical polishing (CMP) process. CMP eliminates many of the fabrication problems associated with the photolithography, dry etch, and metallization of non-planar devices. Furthermore, CMP adds additional design flexibility. The sensors are based upon deformable, silicon nitride diaphragms with polysilicon piezoresistors. Absolute pressure is detected by virtue of reference pressure cavities underneath the diaphragms. Process details are discussed and characteristics from many devices are presented.