Roll-to-roll thermal embossing for large area microstructure formation and application

摘要

We have investigated roll-to-roll thermal embossing as well as roll-to-plate thermal embossing processes for large area, high aspect fabrication of microstructures on polymer films. Micro pillar arrays with diameter of 50 μm and pitch of 100 μm have been formed on polypropylene films as well as polycarbonate films under different embossing conditions. The micro pillar arrays can be used for light diffusing or for surface modification to improve surface hydrophobicity. In this paper, we will report achievements in thermal embossing and explore potential industrial applications.