Molded interconnect devices (MID) offer great potential for circuit board applications, especially regarding three-dimensional shaping and functional integration. Applying circuits to polymer substrates can be performed by means of laser patterning methods. In these, the matrix polymer is filled with a special metal additive, enabling laser activation and subsequent metallization. Important effects emerge during processing of the matrix polymer. In this work, the influence of the gate geometry and the resulting flow behavior during injection molding on the quality of the metallization is investigated.
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