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Is Sputtering Relevant For Ion-Induced Self-Organized Pattern Formation?

机译:溅射是否与离子诱导的自组织图案形成相关?

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Recently it was reported that ion-induced mass redistribution rather than sputtering would solely determine ripple pattern formation of ion-irradiated surfaces. We investigate the pattern formation on Si irradiated with Xe ions with energies of 5 and 10 keV. Sputter yield and collision cascade characteristics vary strongly as function of ion energy, ion mass and substrate material and allow us to investigate the contributions of curvature dependent erosion as well as mass redistribution. The experimental results are compared with calculations of the curvature coefficients Sx and Sy. Parameters required for the calculations are extracted from Monte Carlo simulations with program SDTrimSP. The calculated curvature coefficients show that mass redistribution is dominant for parallel ripple formation in most cases. The angle where the pattern orientation changes from parallel to perpendicular ripples is however related to curvature dependent sputtering. We discuss the possibilities to tune the different contributions to pattern formation and examine the possibility to completely eliminate mass redistribution effects.
机译:最近据报道,离子诱导的质量再分布而不是溅射将仅确定离子辐照表面的纹波图案形成。我们研究了用5至10keV的能量照射的Si上的模式形成。溅射产量和碰撞级联特性随着离子能量,离子质量和基材材料的功能而变化强烈,并允许我们研究曲率依赖性侵蚀以及质量再分布的贡献。将实验结果与曲率系数Sx和Sy的计算进行了比较。使用程序SDTRIMSP从Monte Carlo仿真中提取计算所需的参数。计算出的曲率系数表明,在大多数情况下,质量再分布在平行纹波形成中是显性的。然而,与垂直涟漪平行的图案取向变化的角度与曲率依赖性溅射有关。我们讨论了调整模式形成的不同贡献的可能性,并检查完全消除质量再分配效果的可能性。

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