Failure analysis considerations in designing for EOS/ESD robustness

摘要

Physical failure observation is critical in determining the root-cause of ESD and EOS failures that may be due to circuit design weaknesses, product assembly shortcomings or electrical testing methodology issues. The insight gained from various physical analysis tools is instrumental in the product or system re-design or corrective action in the electrical testing. Three case studies demonstrate the effectiveness of failure visualization coupled with a systematic analysis flow to address ESD and EOS related failures. The identification of the physical damage is shown to help in the implementation of the appropriate corrective measures for a more robust product.