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Performance of SOI MOSFETs with Ultra-Thin Body and Buried-Oxide

机译:具有超薄体和埋氧化物的SOI MOSFET的性能

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摘要

The electrical characteristics in ultra-thin (8 nm) SOI-MOSFETs with 10 nm buried oxide thickness were studied. Threshold voltage was effectively controlled for both of N-channel and P-channel SOI-MOSFETs even in the short devices (45 nm). No degradation of the mobility due to the use of thin buried oxide could be detected. Through appropriate back-gate biasing, the performance of ultra-thin SOI-MOSFETs can be improved dramatically. In P-channel SOI-MOSFETs, the hole mobility measured in volume conduction regime is higher than when only one interface (Si/high-K or Si/SiO_2) is activated. This gain makes the hole mobility comparable with the universal mobility law and is promising for performance enhancement in CMOS circuits.
机译:研究了具有10nm掩埋氧化物厚度的超薄(8nm)SOI-MOSFET中的电特性。即使在短装置(45nm)中,对于N沟道和P沟道SOI-MOSFET也有效地控制阈值电压。由于使用薄掩埋氧化物而没有迁移性的劣化。通过适当的后栅偏置,可以显着提高超薄SOI-MOSFET的性能。在P沟道SOI-MOSFET中,在体积传导方案中测量的空穴迁移率高于仅激活一个界面(Si / HigH-K或Si / SiO_2)时的迁移率。该收益使得与通用移动性法相当的空穴迁移率,并且很有希望在CMOS电路中进行性能增强。

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