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Investigation of Galvanic Corrosion Characteristics between Tantalum Nitride and Poly Silicon in Dilute HF Solutions

机译:稀氢溶液中氮化钽和聚硅之间电流腐蚀特性的研究

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Galvanic corrosion characteristics between poly-Si and tantalum nitride (TaN) (area ratio 1:1 and 1:4) have been investigated in very dilute HF solutions (0.01 to 0.05%) containing controlled levels of dissolved oxygen. The increase in exposed cathode (metal) area as well as aeration results in higher corrosion of poly-Si. In de-aerated HF solutions (less than 0.5 ppm of O_2), irrespective of the area ratio, there appears to be no silicon loss. Morphological changes on poly-Si due to galvanic corrosion have been characterized using Scanning Electron Microscopy.
机译:在非常稀释的HF溶液(0.01至0.05%)的溶解氧水平的非常稀释的HF溶液(0.01至0.05%)中,研究了多Si和氮化钽(褐色)(面积比1:1和1:4)之间的电抗腐蚀特性。暴露的阴极(金属)区域的增加以及通气的曝气导致多Si的腐蚀更高。在脱气的HF溶液(小于0.5ppm的O_2),无论面积比如何,似乎都没有硅损失。使用扫描电子显微镜表征了由于电硅腐蚀引起的多Si的形态学变化。

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