As device manufacturers execute their roadmaps, die shrinks are leading to progressively finer bond pad pitches with consequently smaller bond pad openings on which first bonds are placed. Bond pad pitches as low as 40 micrometers are currently in production with near-term roadmaps pushing to 35 micrometers and below. Based on statistical process capability models aligned with production process parameters, this paper will discuss how decisions made at the device, package, and equipment levels influence ultra fine pitch wire bonding process capability. Discussion will include equipment capability, wire and process selection, process specification, and device and package design considerations. Recommendations are made for how device manufacturers, package designers, and equipment manufacturers can work together to facilitate a smooth transition to sub-40 micrometer wire bonding.
展开▼
