Ultrasonic technologies enable ultra-fine-pitch, low-temperature bonding

摘要

UItra-fine-pitch wire bondinq requires hiqher stability of ultrasonic vibrajtions than achieved by current ultrasonic transducers. BGA packages and low-temperature bonding demand higher bonding frequencies and force the design of stable, high-frequency converters. The demand for higher throughput and improved placement accuracy necessary for ultra-fine-pitch bonding necessitates new requirements in the dynamic mechanical behavior of the horn. Also, the bonding of new materials like copper requires optimal vibration frequencies of the ultrasonic transducers. To address this, new high-frequency ultrasonic transducers and a new mounting approach have been devised.